Our Fusion Mold combines a soft, flexible substrate with a rigid top layer. This provides both maximized production yield (>99%) and high resolution nanopatterns (sub-10 nm).

A unique buffer layer between the soft substrate and rigid top layer is formed by fusing the dissimilar materials together. By fusing in a gradient manner, the buffer layer effectively alleviates stress defects common in other hybrid molds. The result is enhanced, defect-free bonding of the two materials. The Fusion Mold has a lifetime comparable to the Quick Mold.